Method and apparatus for the encapsulation of a se

专利名称：Method and apparatus for the

encapsulation of a semiconductor devicemounted on a lead-frame

发明人：Orcutt, John W.申请号：EP87116747.4申请日：19831004公开号：EP0305589A1公开日：19890308

专利附图：

摘要：A lead frame (40) for receiving a semiconductor device (120) to be encapsulatedincludes a thoroughfare (300) formed as a solid (non-perforated) part of the strip in

which the frame is formed. Apparatus and method for packaging the semiconductordevice when secured to the lead frame comprises a mold in which the device and frameare accommodated in the mold. Plastic in fluent form is supplied through a runner(265,290) to the mold (190) containing the semiconductor devices (120) and the strip (20).The mold (190) forms a cavity (280) about the semiconductor device (120) and the portionof its associated lead frame (40) adjacent to the semiconductor device (120). The plastic isdirected over the thoroughfare (300) into the cavities (280) adjacent to the thoroughfare(300).

申请人：TEXAS INSTRUMENTS INCORPORATED

地址：13500 North Central Expressway Dallas Texas 75265 US

国籍：US

代理机构：Abbott, David John

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